product smallclass 1

headset

Features

Low-cost, low-power FPGA fabric

1.0V and 1.2V core voltage options

Available in commercial, industrial, and automotive temperature grades

Several package types and footprints:

FineLine BGA (FBGA)

Enhanced Thin Quad Flat Pack (EQFP)

Ultra FineLine BGA (UBGA)

Micro FineLine BGA (MBGA)

Multiple device densities with pin migration capability

RoHS6 compliance

Logic elements — four-input look-up table (LUT) and register

Abundant routing/metal interconnect between all LEs

M9K — 9 kilobits (Kb) of embedded SRAM memory blocks, cascadable

Applications

I/O expansion

Interfacing

Bridging

Sensor fusion

Industrial motor control